DRAM Packaging Engineer
Santa Clara Valley (Cupertino), California, United States
Hardware
Envision what you could do here. At Apple, we believe new ideas have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. As a member of our dynamic group, you will have the rare and rewarding opportunity to craft upcoming products that will delight, and inspire millions of Apple’s customers every single day.
Summary: Do you like to work on groundbreaking technologies that enable amazing new products? Do you have the attention for details and love for perfection to work towards an extraordinary result? We are looking for a hardworking and passionate DRAM Packaging Engineer to join our team. SEG Packaging is a key part of the HW Technologies team, this team invents, designs, develops and integrates electronic packaging solutions for the Apple’s internal and customized external components of hardware for its consumer electronic products. As a DRAM packaging engineer, you will lead the memory package development by managing the external memory vendors and steering their packaging design compatibility to Apple system components. You will partner with the internal SEG teams, defining the memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the system and product teams and overall program through the development and NPI cycle.
Key Qualifications
- 5+ years’ experience in memory package architecture and assembly process development for stacked-die packages
- Strong knowledge of advanced packaging technology, design rules, SIPI, to architect high-density packages.
- Strong knowledge of packaging materials, substrate technology, and their mechanical and thermal behaviors
- Solid working experience in package test and reliability, system-level downstream process interaction and packaging inspection metrology
- Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
Description
Define memory package architectures with advanced package processes, to support memory bandwidth and density needs, in conjunction with downstream assembly constraints
Define the memory package POR (plan of record): Form factor, technology, process, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity
Publish internal package specs for customized memory
Establish trusting and collaborative relationship and communication channels, as a direct interface with vendors for DRAM memory package development and qualification
Review, drive and approve the DRAM memory vendors DOEs/characterization plans, technology and product qualification and data for package development
About 10% international travel required
Education & Experience
BS and 10+ years of relevant industry experience.