Advanced Package Development Engineer

Santa Clara Valley (Cupertino), California, United States
Hardware

Summary

Posted:
Role Number:200468978
Imagine the pride of having your hardwork being in the hands of a billion people all over the world? That’s the pleasure we find here being able to work at Apple. A company that has consistently brought ground-breaking technologies to the average consumer and has enabled just about anybody to carry a high performance computer in their pocket. If you are motivated by crafting advanced technologies that improve lives everywhere and have unwavering focus on excellence in your craft, then we are looking for you! Bring your technology skills and self-motivation to your job here and be prepared for an adventure! This position will support Apple’s Advanced Packaging Program with responsibilities for package integration and technology development.

Key Qualifications

  • Silicon fab interconnect process integration experience in BEoL process, RDL, fine pitch μ-bumps, hybrid bonds, TSVs, etc.
  • Deep knowledge of electrical, mechanical and thermal properties of fab materials
  • Strong expertise in Si Fab equipment and Fab Logistics Management
  • Experience on advanced packaging for groundbreaking CMOS nodes
  • Expertise on Si structure yield and reliability mechanisms and analyses
  • Good familiarity with electrical, mechanical and/or thermal characterization, failure analysis
  • Tool experience: One or more of TCAD, JMP, Virtuoso, KLayout, Ansys EDT
  • Capable of independent R&D Work in a cross-functional team, driving vendors
  • Excellent communication skills
  • Experience in Si fab integration role and advanced packaging

Description

Developing advanced packaging technologies in a cross-functional team. You will be responsible for Package integration and technology development.

Education & Experience

BS and 10+ years of relevant industry experience.

Additional Requirements

Pay & Benefits