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NAND Packaging Engineer
Cupertino, CA
Job Description
Summary
Posted: Oct 3, 2023
Role Number:200450101
Envision what you could do here. At Apple, we believe new ideas and insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. As a member of our dynamic group, you will have the rare and rewarding opportunity to craft upcoming products that will delight, and inspire millions of Apple's customers every single day. SEG Packaging is a key part of the HW Technology team. This team invents, designs, develops and integrates electronic packaging solutions for the Apple's internal and customized external components of hardware for its consumer electronic products. As a NAND packaging engineer, you will lead the memory package development by managing the external memory vendors and steering their packaging design compatibility to Apple system components. You will partner with other cross functional teams, defining the memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the system and product teams and overall program through the development and NPI cycle.
Key Qualifications
Description
Define the memory package POR (plan of record): Package architecture, technology, process, form factor, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity Publish internal package specs for customized memory Establish trusting and collaborative relationships and communication channels, as a direct interface with vendors for memory package development and qualification Review, drive, and approve memory vendor DOEs, characterization plans, technology and product qualification Drive industry with advanced package design rules, processes, materials, and leading-edge specifications About 10% international travel required
Education & Experience
BS and 3+ years of relevant industry experience
Additional Requirements
Pay & Benefits
Posted: Oct 3, 2023
Role Number:200450101
Envision what you could do here. At Apple, we believe new ideas and insights have a way of becoming extraordinary products, services, and customer experiences very quickly. Bring passion and dedication to your job and there's no telling what you could accomplish. As a member of our dynamic group, you will have the rare and rewarding opportunity to craft upcoming products that will delight, and inspire millions of Apple's customers every single day. SEG Packaging is a key part of the HW Technology team. This team invents, designs, develops and integrates electronic packaging solutions for the Apple's internal and customized external components of hardware for its consumer electronic products. As a NAND packaging engineer, you will lead the memory package development by managing the external memory vendors and steering their packaging design compatibility to Apple system components. You will partner with other cross functional teams, defining the memory package architecture, die pad layout, package form factor, interconnect and package density, and will support the system and product teams and overall program through the development and NPI cycle.
Key Qualifications
- We are looking for someone with 2+ years' experience in package design and assembly process development for stacked-die memory packages
- Strong knowledge of wirebond and flip-chip assembly process applied to thin-die stacking
- Strong knowledge of packaging materials, substrate technology, and their mechanical and thermal behaviors
- Working knowledge of assembly design rules, SIPI, and layout tradeoffs to enable high performance DDR or differential signaling
- Solid working experience in package test and reliability, system-level downstream process interaction, and packaging inspection metrology
- Excellent engineering problem solving skills, with strong engineering physics and data driven analysis
- Strong written and verbal communication skills for working with internal multi-functional teams and OSATs
Description
Define the memory package POR (plan of record): Package architecture, technology, process, form factor, layout, bill of materials (BOM), design rules, thermo-mechanical, signal integrity, power integrity Publish internal package specs for customized memory Establish trusting and collaborative relationships and communication channels, as a direct interface with vendors for memory package development and qualification Review, drive, and approve memory vendor DOEs, characterization plans, technology and product qualification Drive industry with advanced package design rules, processes, materials, and leading-edge specifications About 10% international travel required
Education & Experience
BS and 3+ years of relevant industry experience
Additional Requirements
Pay & Benefits
- At Apple, base pay is one part of our total compensation package and is determined within a range. This provides the opportunity to progress as you grow and develop within a role. The base pay range for this role is between $138,900.00 and $256,500.00, and your base pay will depend on your skills, qualifications, experience, and location.
Apple employees also have the opportunity to become an Apple shareholder through participation in Apple's discretionary employee stock programs. Apple employees are eligible for discretionary restricted stock unit awards, and can purchase Apple stock at a discount if voluntarily participating in Apple's Employee Stock Purchase Plan. You'll also receive benefits including: Comprehensive medical and dental coverage, retirement benefits, a range of discounted products and free services, and for formal education related to advancing your career at Apple, reimbursement for certain educational expenses - including tuition. Additionally, this role might be eligible for discretionary bonuses or commission payments as well as relocation. Learn more about Apple Benefits.
Note: Apple benefit, compensation and employee stock programs are subject to eligibility requirements and other terms of the applicable plan or program.
Apple is an equal opportunity employer that is committed to inclusion and diversity. We take affirmative action to ensure equal opportunity for all applicants without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, Veteran status, or other legally protected characteristics.
Job Summary
Company
Start Date
As soon as possible
Employment Term and Type
Regular, Full Time
Required Experience
1 to 2 years
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