About Marvell

Marvell's semiconductor solutions are the essential building blocks of the data infrastructure that connects our world. Across enterprise, cloud and AI, automotive, and carrier architectures, our innovative technology is enabling new possibilities.

At Marvell, you can affect the arc of individual lives, lift the trajectory of entire industries, and fuel the transformative potential of tomorrow. For those looking to make their mark on purposeful and enduring innovation, above and beyond fleeting trends, Marvell is a place to thrive, learn, and lead.

Your Team, Your Impact

What You Can Expect

• Lead the packaging engineering team, setting high standards for execution and innovation, while fostering a collaborative and results-driven environment.
• Strategically manage the development and implementation of advanced packaging technologies to enhance product performance and reliability.
• Provide technical leadership in the design, simulation, and analysis of semiconductor packages to ensure optimal thermal, mechanical, and electrical performance.
• Work closely with cross-functional teams (R&D, design, manufacturing, quality, and supply chain) to ensure seamless integration and alignment of packaging strategies with company goals.
• Drive continuous improvement initiatives in packaging processes, tools, and methodologies to reduce cost, improve quality, and enhance yield.
• Manage the team's project portfolio, prioritizing tasks and allocating resources to meet deadlines and business objectives efficiently.
• Mentor and develop team members, enhancing their skills and career progression through targeted training and challenging project assignments.
• Stay abreast of industry trends, technological advancements, and competitive strategies in semiconductor packaging to ensure Marvell remains at the cutting edge.
• Lead troubleshooting and problem-solving efforts related to packaging design and process issues, implementing robust solutions to prevent recurrence.
• Contribute to the intellectual property portfolio of the company through innovation and patent generation in the field of semiconductor packaging.

What We're Looking For

• Bachelor's degree in Mechanical Engineering, Materials Science, Chemical Engineering, or a related technical field; advanced degree (MS or PhD) preferred.
• Minimum of 10 years of experience in semiconductor packaging engineering, with a comprehensive understanding of advanced packaging technologies such as 2.5D, 3D IC, Flip Chip, WLCSP, and Fan-Out.
• At least 5 years of experience in a leadership or management role, with a proven track record of building, leading, and mentoring a high-performing engineering team.
• Strong project management skills, with the ability to lead complex projects across cross-functional teams.
• Excellent analytical and problem-solving skills, with a strong focus on results and a commitment to quality.
• Exceptional communication and interpersonal skills, capable of fostering strong internal and external relationships.
• Demonstrated ability to operate effectively in a fast-paced, dynamic environment, adapting to evolving business and technical challenges.
• Familiarity with relevant industry standards and regulatory requirements related to semiconductor packaging.

Expected Base Pay Range (USD)

The successful candidate's starting base pay will be determined based on job-related skills, experience, qualifications, work location and market conditions. The expected base pay range for this role may be modified based on market conditions.

Additional Compensation and Benefit Elements

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, national origin, sexual orientation, gender identity, disability or protected veteran status.

Any applicant who requires a reasonable accommodation during the selection process should contact Marvell HR Helpdesk at .