Company Overview:
MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard.

MACOM has more than 65 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Go to www.macom.com to view our facilities. In addition, MACOM offers foundry services that represents a key core competency within our business.

MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio.

Mechanical Design Engineer (Packaging)

The packaging engineering group of MACOM supports the design, development, and implementation of packaging solutions for RF semiconductor devices.

Key Duties:

• Create new package designs using input from RF design, manufacturing, and package suppliers.
  
• Generate and review assembly and outline drawings using CAD software
• Collect data directly or coordinate work with external labs, using metrology and failure analysis tools and techniques
• Design experiments and analyze results using statistical techniques and process improvement methodology
• Work with material suppliers and assembly subcontractors to understand processes and design rules to help guide new product designs
• Run thermal and mechanical simulations with FEA software packages to characterize new materials and device designs
• Create reports of work and present to other engineers and management

Job Requirements:

• BS in Mechanical Engineering, Manufacturing Engineering, Materials Science, or related discipline
• 7+ years of relevant work experience in the semiconductor industry
• Experience in semiconductor assembly processes including die attach, wire bond, lid seal, plastic overmolding, singulation, etc.
• Understanding of reliability, failure analysis, and quality controls in package development and qualification
• Excellent teamwork and good verbal and written communication skills
• Good critical thinking and problem solving skills

EEO:

MACOM is an Equal Opportunity Employer committed to a diverse workforce. MACOM will not discriminate against any worker or job applicant on the basis of race, color, religion, gender, gender identity, gender expression, national origin, ancestry, age, sexual orientation, marital or civil partnership status, pregnancy, disability, genetic information, veteran status, military obligations, or membership in any other category protected under applicable law.

Reasonable Accommodation:

MACOM is committed to working with and providing reasonable accommodations to qualified individuals with physical and mental disabilities. If you have a disability and are in need of a reasonable accommodation with respect to any part of the application process please call +1-978-656-2500 or email HR_Ops@MACOM.com. Provide your name, phone number and the position title and location in which you are interested, and nature of accommodation needed, and we will get back to you. We also work with current employees who request or need reasonable accommodation in order to perform the essential functions of their jobs.